Consult

Consultation

  • Can be arranged on an hourly basis, or project basis.
  • Different rates for micromachining consultation and micrometrology consultation
  • Educational institutions at reduced or nil rates- please call to discuss.
  • Billing: Travel, hotel, taxi, visa and all other expenses are billed at actuals. Overnight stays billed at a single rate.
  • Terms: Net 30 days unless otherwise agreed upon.
  • Terms for Governmental organizations are different.

Lectures on Micromachining

  • Free within Chennai and nearby cities, or as per institution’s rules. Please provide end to end transportation and other arrangements.
  • General overview of Micromachining, specific areas in laser Micromachining. Since this is from an industry expert, the lecture will be less academic.

Phone: 91-44-244 014 60     (Country code – Area code – phone number)

E-mail: contact@onestopmicro.com

Address:

1b, Block 1, Lakshmima,

40, 4th Seaward Road, Valimiki Nagar, Tiruvanmiyur,

Chennai 600041, India

Nearest Domestic/International Airport: Chennai

Timezone: +5.5 hrs GMT

Representation:

For Micromachining equipment, sales and service, liason. Please call or write to discuss. English/Spanish. Si Habla Español.

  1. April 1st, 2010 at 06:11 | #1

    Hello

    I am freelancer and working on MEMS projects with DRDO. I have a requirement in which a device is fabricated with three wafers fusion bonded together. For such three stack bonded wafers, the dicing becomes a very critical. Can Laser micromachining be used for such purposes?

  2. April 1st, 2010 at 11:05 | #2

    There are numerous ways to do it.
    If HAZ is critical (it usually is), a tripled YAG or Vanadate with a scanner should do the job.
    DOF can be an issue though. What’s the wafer thickness?

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